Recent progress in ohmic contacts to silicon carbide for high-temperature applications

Z Wang, W Liu, C Wang - Journal of Electronic Materials, 2016 - Springer
During the past few decades, silicon carbide (SiC) has emerged as the most promising wide-
bandgap semiconductor for high-temperature, high-frequency, and high-power applications …

Карбид кремния: технология, свойства, применение

ОА Агеев, АЕ Беляев, НС Болтовец, ВС Киселев… - 2010 - elibrary.ru
Настоящая коллективная монография содержит теоретические и экспериментальные
результаты по методам выращивания монокристаллов и эпитаксиальных пленок SiC, а …

Raman study of Ni and Ni silicide contacts on 4H–and 6H–SiC

S Cichoň, P Macháč, B Barda, V Machovič, P Slepička - Thin Solid Films, 2012 - Elsevier
Ni2Si, NiSi and NiSi2 contacts were prepared on n-type 4H–and 6H–SiC (0001) by
deposition of Ni and Si multilayers in the respective stoichiometry after high-temperature …

Preparation and properties of thin amorphous tantalum films formed by small e-beam evaporators

K Stella, D Bürstel, S Franzka, O Posth… - Journal of Physics D …, 2009 - iopscience.iop.org
Abstract Large area (A= 6 cm 2), thin tantalum films (5 nm< d< 100 nm) are accomplished by
evaporation from tantalum rods using small pocket e-beam evaporators. Using a sample to …

Comparison of Ni/Ti and Ni ohmic contacts on n-type 6H–SiC

B Barda, P Macháč, M Hubičková, J Náhlík - Journal of Materials Science …, 2008 - Springer
Abstract Ni (50 nm)/Ti (10 nm) and Ni (50 nm) contact structures were deposited by vacuum
evaporation on n-type 6H–SiC with various doping level. Prior to deposition, part of the …

Si ohmic contacts on N-type SiC studied by XPS

S Cichoň, P Macháč, B Barda, M Kudrnová - Microelectronic engineering, 2013 - Elsevier
Si ohmic contacts on N-type 4H–and 6H–SiC with contact resistivity comparable with Ni
metallizations were prepared. After etching-off of the Si contacts and deposition of new …

Electrical and structural properties of TaSiN electrode for phase change random access memory

KM Jung, MS Jung, YB Kim, DK Choi - Thin Solid Films, 2009 - Elsevier
Characteristics of tantalum silicon nitride (TaSiN) thin films have been investigated as an
electrode material for Ge2Sb2Te5 chalcogenide phase change material. The films were …

[PDF][PDF] Ni and Ni silicides ohmic contacts on N-type 6H-SiC with medium and low doping level

S Cichoň, B Barda, P Macháč - Radioengineering, 2011 - core.ac.uk
Ni silicides contacts, which are expected to be advantageous contact materials on SiC, were
tested in this work. Prepared contact structures were ohmic with low contact resistivity …

[PDF][PDF] 氢氟酸刻蚀对Ni/6H-SiC 接触性质的作用

黄维, 陈之战, 陈博源, 张静玉, 严成锋, 肖兵, 施尔畏 - 物理学报, 2009 - wulixb.iphy.ac.cn
采用浓度为10% 的氢氟酸(HF) 刻蚀6H. SiC 单晶片, 研究了HF 刻蚀时间对Ni/6H. SiC
接触性质的影响. 经24 h 刻蚀的SiC 基片在溅射Ni 层后, 其接触表现良好线性的电流. 电压(IV) …

[图书][B] Electronic dissipation processes during chemical reactions on surfaces

K Stella - 2011 - books.google.com
Every day in our life is larded with a huge number of chemical reactions on surfaces. Some
reactions occur immediately, for others an activation energy has to be supplied. Thus it …