Rapid advancements in nanotechnologies for energy conversion and transport applications
urgently require a further understanding of interfacial thermal transport and enhancement of …

Abstract In recent years, Cu–Sn solid–liquid interdiffusion (SLID) bonding has been used in
semiconductor packaging, die-attach, fine-pitch interconnection, and through-silicon vias …

Abstract For the common Cu-Sn interconnection system in microelectronics packaging, a
significant concern is the sporadic interfacial void formation within the Cu–Sn interface and …

Due to the advantages of small form factor, high performance, low power consumption, and
high density integration, three-dimensional integrated circuits (3D ICs) have been generally …

To promptly form a bondline with high thermal stability and thermal conductivity using a
small amount of expensive Ag, dies were attached to Ag finishes by pressure-assisted sinter …

Pressure-assisted sinter bonding between an Ag-finished die and an Ag-finished substrate
was performed in air using an Ag-coated Cu (Cu@ Ag) particulate preform to rapidly achieve …

In this study, an effective transient liquid phase (TLP) bonding structure using a composite
solder preform including a Cu metal foam was formed. Cu foam has a large surface area …

With the development of high-integration and high-power electronics, the lack of matching
chip connecting materials that can withstand high temperatures has been a challenge. In …

The rapid development of the third-generation semiconductors has posed new requirements
and challenges for power electronic packaging. In recent years, the utilization of nano-Ag …

Microbumps play a crucial role in interlayer interconnections for advanced packaging.
Among the prevalent microbump structures are Cu/Sn and Cu/Ni/Sn configurations …