A grid array antenna working around 145 GHz is proposed in this paper. The antenna is built
on liquid crystal polymer (LCP) and designed for the D-band antenna-in-package …

This article presents a hybrid process to fabricate chip-to-board interconnects for microwave
and millimeter-wave applications. It is a four-step process: 1) cavities are etched in a copper …

With an ever increasing number of broadband applications in sub-Saharan Africa, mm-wave
point-to-point networking has the potential to fill a niche in communications network …

A complete chip-package-board co-design of bonding transition for a quad flat pack nonlead
(QFN) package was conducted from dc to millimeter wave frequencies. First, two ground …

In this paper, a gallium nitride (GaN)-based power amplifier (PA) is cooled and tuned thanks
to multifunctional hybrid microfluidic channels integrated on a multilayer organic substrate …

An interconnect transition within the plastic mold is formed between the output ports of the IC
sitting on top of a Quad Flat Non-leaded (QFN) package and the nearby I/O leads of the …

This paper presents, for the first time, a microfluidic tuning solution on a multilayer organic
substrate to tune the frequency response of a GaN-based power amplifier (PA) from 2.4 GHz …

RF and millimeter-wave designers continue to use wire bonds and flip chip in their designs
when bonding chips or multichip systems. Due to electrical and mechanical constraints of …

Due to the needs of miniature and conformal antenna arrays of SAR satellite, the research of
curved multi-element active sub-arrays is carried out. Conformal RF sub-array is designed …

Thermal management is an important aspect for any packaging technology incorporating
high power devices. In this paper, we present an integrated microfluidic cooling solution for …