H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid
state devices; Multistep manufacturing processes thereof the devices being of types …

A semiconductor device includes a substrate including a first surface and a second surface
opposite to each other, a through-via electrode extending through the substrate. The through …

A method of manufacturing a semiconductor package includes preparing a parent substrate
including package board parts laterally spaced apart from each other, mounting a first chip …

Zafman LLP (57) ABSTRACT A 3D memory that is configurable for performance and power.
An embodiment of a memory device includes a dynamic random-access memory (DRAM) …

(57) ABSTRACT A packaged semiconductor device includes a data pin, a first memory die,
and a second memory die stacked with the first memory die. The first memory die includes a …

BACKGROUND The market for electronic apparatus and systems is driving industry to
higher operating speeds for processors and enhanced storage capacity in the devices …

(51) Int. Cl.(57) ABSTRACT G06F I3/00(2006.01) A semiconductor memory system includes
a first semicon C. 1. FC ZZ}{}(2006.01) ductor memory die and a second semiconductor …

(57) ABSTRACT A semiconductor device includes a Substrate including a first Surface and a
second Surface opposite to each other, a through-via electrode extending through the …

A system for memory device control may include a stacked memory device and a memory
controller. The stacked memory device may include a stack of chips connected to a package …

A semiconductor chip includes a semiconductor substrate, a through electrode, an inter-
mediation pad, an upper pad, and a rewiring line. The semiconductor substrate includes a …