We review the measurement methods and thickness characterization algorithms of
semiconductor multilayer devices. Today's ultrahigh-density, high-energy-efficient three …

Abstract Two-dimensional (2D) materials have attracted great attention because of their
unique physical properties and versatile applications in electronics and photonics. Following …

In this research, an approach called modulation-based structured-illumination microscopy
(MSIM) is proposed to measure the surface and thickness profile of thin film layers. With this …

The nanoscale quantification of the electrochemical behavior in metals is critical to
understanding the microstructure-corrosion relationship and subsequently controlling it. In …

Fringe analysis using phase modulation through wavelength scanning is extensively utilized
for profiling the surface and thickness variation of glass plates. However, the nonlinearity of …

In this review, we present the recent progress on film metrology focused on the advanced
and novel technologies during the last two decades. This review consists of various …

With the growth of 3D packaging technology and the development of flexible, transparent
electrodes, the use of multilayer thin-films is steadily increasing throughout high-tech …

Layer thickness of thin and multi-layer coatings is a major design parameter to functionalise
surfaces in a broad range of industrial applications. Conventional measurement methods …

For a long time, obtaining the optical and morphological properties of a transparent sample
with high accuracy without degrading the layer has been challenging. To achieve these …

This paper reports on progress in the analysis of time-domain optical coherence tomography
(OCT) applied to the dimensional metrology of through-silicon vias (TSVs), which are vertical …