Nano material removal mechanism of 4H-SiC in ion implantation-assisted machining
As a third-generation semiconductor material, four-hexagonal silicon carbide (4H-SiC) finds
wide application in industries. The high efficiency and performance machining of 4H-SiC …
wide application in industries. The high efficiency and performance machining of 4H-SiC …
Dynamic modeling of the turning process of slip-cast fused silica ceramics using the discrete element method
H Roostai, MR Movahhedy - Proceedings of the Institution of …, 2020 - journals.sagepub.com
Simulation of brittle regime machining of materials (such as ceramics) is often difficult
because of the complex material removal mechanisms involved. In this study, the discrete …
because of the complex material removal mechanisms involved. In this study, the discrete …
Investigation of contact parameters of DEM model in flow process
X Xiao, Y Tan, R Deng, S Jiang, W Gao… - Proceedings of the 7th …, 2017 - Springer
In the flow and accumulation process of granular materials, the appropriate choice of contact
parameters has an important influence on the accuracy and precision of the simulation …
parameters has an important influence on the accuracy and precision of the simulation …
[PDF][PDF] Dynamic modeling of crack propagation in ceramic laminate-toughened composites with weak interfaces by using discrete element method
W Zhang - 2014 - core.ac.uk
I am very grateful to Professor Rainer Telle for his excellent guidance, valuable advice,
constant encouragement and enormous patience with my progress through the years of this …
constant encouragement and enormous patience with my progress through the years of this …