(56) References Cited 2004/0043607 A1 3/2004 Farnworth et al. 2004/0051173 A1 3, 2004
Koh et al. US PATENT DOCUMENTS 2004/006 1238 A1 4/2004 Sekine 2004/0104454 A1 …

(57) ABSTRACT A microelectronic unit includes a microelectronic element, eg, an integrated
circuit chip, having a semiconductor region of monocrystalline form. The semiconductor …

US8405196B2 - Chips having rear contacts connected by through vias to front contacts -
Google Patents US8405196B2 - Chips having rear contacts connected by through vias to …

In accordance with one embodiment, a solid state image sensor can include a
microelectronic element having a front face and a rear face remote from the front face. The …

2010-11-08 Assigned to TESSERA RESEARCH LLC reassignment TESSERA RESEARCH
LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS) …

A method of fabricating a microelectronic unit includes providing a semiconductor element
having a front Surface and a rear Surface remote from the front Surface, forming at least one …

6,864,172 B2 3/2005 Noma et al. 2008/0090333 A1 4, 2008 Haba et al. 6,867,123 B2
3/2005 Katagiri et al. 2008/0099900 A1* 5/2008 Oganesian et al............ 257,678 6,879,049 …

22 SO 2 3. semiconductor devices. The microelectronic unit can also include a first
conductive element exposed at the rear Surface for connection with an external component …

(57) ABSTRACT A method for bonding a first copper element onto a second copper element
including forming a crystalline copper layer enriched in oxygen on each of surfaces of each …

(57) ABSTRACT A microelectronic assembly is provided which includes a first element
consisting essentially of at least one of semiconduc tororinorganic dielectric material having …