A review of SiC power module packaging technologies: Challenges, advances, and emerging issues
Power module packaging technologies have been experiencing extensive changes as the
novel silicon carbide (SiC) power devices with superior performance become commercially …
novel silicon carbide (SiC) power devices with superior performance become commercially …
Automotive power module packaging: Current status and future trends
Y Yang, L Dorn-Gomba, R Rodriguez, C Mak… - IEEE …, 2020 - ieeexplore.ieee.org
Semiconductor power modules are core components of power electronics in electrified
vehicles. Packaging technology often has a critical impact on module performance and …
vehicles. Packaging technology often has a critical impact on module performance and …
A review of SiC power module packaging: Layout, material system and integration
Silicon-Carbide (SiC) devices with superior performance over traditional silicon power
devices have become the prime candidates for future high-performance power electronics …
devices have become the prime candidates for future high-performance power electronics …
Parasitic capacitive couplings in medium voltage power electronic systems: An overview
Recent developments within the field of medium voltage wide-bandgap semiconductor
devices are drawing attention from both researchers and industries due to the demanding …
devices are drawing attention from both researchers and industries due to the demanding …
A tutorial on high-density power module packaging
Transportation electrification in many forms along with continued grid modernization efforts
is placing stringent requirements on volumetric and gravimetric power densities for power …
is placing stringent requirements on volumetric and gravimetric power densities for power …
Optimized Power Modules for Silicon Carbide mosfet
G Regnat, PO Jeannin, D Frey… - IEEE Transactions …, 2017 - ieeexplore.ieee.org
A new 3-D power module dedicated to SiC mosfet is presented. It is based on printed circuit
board embedded die technology and is compared with a standard power module. After …
board embedded die technology and is compared with a standard power module. After …
[HTML][HTML] Printed circuit board embedded power semiconductors: A technology review
T Huesgen - Power Electronic Devices and Components, 2022 - Elsevier
Embedding power semiconductor devices into printed circuit boards (PCB) provides several
benefits compared to conventional packaging technologies. Integrating the semiconductor …
benefits compared to conventional packaging technologies. Integrating the semiconductor …
Review of state-of-the-art integration technologies in power electronic systems
As an important development direction of power electronic systems, the integration
technologies can bring many benefits, such as size reduction, reliability improvement, cost …
technologies can bring many benefits, such as size reduction, reliability improvement, cost …
A review of radiated EMI research in power electronics systems
Radiated electromagnetic interference (EMI) is a very important research topic in power
electronics systems in recent years as the switching frequencies of power electronics …
electronics systems in recent years as the switching frequencies of power electronics …
Application of the PCB-embedding technology in power electronics–State of the art and proposed development
The embedding of components in Printed Circuit Board (PCB) material is an attractive
solution to improve the performance of power converters in the 1 W-100 kW range by …
solution to improve the performance of power converters in the 1 W-100 kW range by …