Effective thermal management is quite urgent for electronics owing to their ever-growing
integration degree, operation frequency and power density, and the main strategy of thermal …

Thermal transport performance of polymers and polymer composites has been widely
studied as electrical insulating encapsulations for the many applications in microelectronics …

Thermal conduction for electronic equipment has grown in importance in light of the
burgeoning of 5G communication. It is imperatively desired to design highly thermally …

Flexible dielectric and electronic materials with high dielectric constant (k) and low loss are
constantly pursued. Encapsulation of conductive fillers with insulating shells represents a …

With the rapid development of 5G information technology, thermal conductivity/dissipation
problems of highly integrated electronic devices and electrical equipment are becoming …

To synergistically bolster breakdown strength (E b) and restrain dielectric loss in the copper
(Cu)/poly (vinylidene fluoride, PVDF) presenting a giant dielectric constant (ε), we explore …

In this work, we present a solution to use nitrogen and boron co-effect flame-retardant
(melamine borate, abbreviated as MB) functionalized boron nitride nanosheets (MB-BNNS) …

Abstract Poly (p-phenylene-2, 6-benzobisoxazole) nanofiber (PNF) paper is facing
unprecedented challenges in enhancing the interaction between the PNFs and improving its …

Flexible dielectrics with large dielectric constant (ε′) coupled with low loss are highly
pursued in many applications. To bolster the ε′ of raw Zn (zinc)/poly (vinylidene fluoride …

Polymer-based thermally conductive materials are preferred for heat dissipation owing to
their low density, flexibility, low cost, and easy processing. Researchers have been trying to …