This paper presents a high precision simulation methodology microelectronic packages with
heat sinks, subjected to natural convection or forced convection, that is based on our …

This papers proposes a new methodology for estimating the thermal resistance from the
junction-to-top capsule surface. By placing the transistor in a vertical position, without being …

A bidirectional solid/fluid coupling methodology developed for natural convection [1],[2] has
been applied to the case of forced convection. The two-way coupling methodology is …

This papers proposes a new methodology for estimating the thermal resistance from the
junction-to-top capsule surface. By placing the transistor in a vertical position, without being …

RÉSUMÉ L'assemblage par thermocompression (TCB) est présentement la technique de
choix pour promouvoir la planéité de l'assemblage pendant l'étape critique du brasagea la …