Using microfluidic cooling to achieve thermal management of three-dimensional integrated
circuits (ICs) is recognized as a promising method of extending Moore law progression in …

To address the abating performance improvements from device scaling, innovative 2.5-D
and 3-D integrated circuits with vertical interconnects called through-silicon vias (TSVs) …

In modern integrated systems, interconnect and thermal management technologies have
become two major limitations to system performance. In this paper, a number of …

An integrated circuit package may include an integrated circuit die having first and second
circuit regions and a surface. The first circuit region of the integrated circuit package has an …

An electronic device can include a substrate and an insulating structure. In an aspect, an
anchor can include a portion of the substrate that extends into the insulating structure or a …

An electronic device can include a substrate and an insulating structure laterally surrounded
by the substrate. In an aspect, the electronic device can include a first conductive structure or …

Vertical interconnections, called through‐silicon vias (TSVs), play a key role in enabling
silicon interposer‐based 2.5 D integration (and 3D chip stacking). HIST 2.5 D integration …

When designing an electronic package, there are many material challenges to consider,
both in the semiconductor die and in the package. The die may have fragile low dielectric …

An electronic device can include a substrate and an insulating structure. In an aspect, an
anchor can include a portion of the substrate that extends into the insulating structure or a …

An electronic device can include a semiconductor material and a semiconductor layer
overlying the semiconductor material, wherein the semiconductor layer has a greater …