(57) ABSTRACT A semiconductor device and methods for manufacturing the same are
disclosed. The semiconductor device includes a polymer substrate and an interfacial layer …

A flip chip module having at least one flip chip die is disclosed. The flip chip module includes
a carrier having a top surface with a first mold compound residing on the top surface. A first …

This disclosure relates to integrated circuit (IC) packages and methods of manufacturing the
same. In one method, a printed circuit board is provided with semiconductor die. The …

A printed circuit module and methods for manufacturing the same are disclosed. The printed
circuit module includes a printed circuit substrate with a thinned die attached to the printed …

(57) ABSTRACT A semiconductor device and methods for manufacturing the same are
disclosed. The semiconductor device includes a polymer substrate and an interfacial layer …

The present disclosure relates to a wafer-level package that includes a first thinned die, a
multilayer redistribution structure, a first mold compound, and a second mold compound …

A method of manufacture for a semiconductor device is disclosed. The method includes
providing a semiconductor stack structure that includes a device terminal of a semiconductor …

The present disclosure relates to a wafer-level package that includes a first thinned die
having a first device layer, a multilayer redistribution structure, a first mold compound, and a …

The present disclosure relates to a thermally enhanced semiconductor package, which
includes a module substrate, a thinned flip chip die over the substrate, a first mold …

The present disclosure relates to a packaging process to enhance thermal and electrical
performance of a wafer-level package. The wafer-level package with enhanced performance …