Underfill flow in flip-chip encapsulation process: a review
The scope of review of this paper focused on the precuring underfilling flow stage of
encapsulation process. A total of 80 related works has been reviewed and being classified …
encapsulation process. A total of 80 related works has been reviewed and being classified …
[HTML][HTML] Effect of flip-chip ball grid array structure on capillary underfill flow
HH Hung, YC Cheng, SJ Hwang, HJ Chang… - Results in …, 2024 - Elsevier
During the capillary underfill (CUF) process in flip-chip packaging, issues like incomplete
filling, voids, wire sweeping, and overflow can impact product reliability and the relatively …
filling, voids, wire sweeping, and overflow can impact product reliability and the relatively …
Spatial analysis of underfill flow in flip-chip encapsulation
Purpose The purpose of the study is to investigate the spatial aspects of underfill flow during
the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump …
the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump …
Analysis of flip-chip ball grid array underfill flow process
HH Hung, YC Cheng, SJ Hwang, DL Chen… - … International Journal of …, 2024 - Springer
This study provides an in-depth simulation of the capillary underfill (CUF) process for flip-
chip packages using Moldex3D, offering a comprehensive analysis that integrates material …
chip packages using Moldex3D, offering a comprehensive analysis that integrates material …
Prediction of the void formation in no-flow underfill process using machine learning-based algorithm
This paper investigated the variation variables on the void formation in the no-flow underfill
process. A total of 96 distinct no-flow underfill cases were numerically simulated to …
process. A total of 96 distinct no-flow underfill cases were numerically simulated to …
Correlation study on voiding in underfill of large quantity ball grid array chip using machine learning
This paper investigates voiding issues in the underfilling process of ball grid array (BGA)
chip packages under various parameter settings such as chip conveyor speed, valve …
chip packages under various parameter settings such as chip conveyor speed, valve …
No-flow underfill: Effect of chip placement speed on the void formation using numerical method
No-flow underfill process can enhance the production lead time since the curing and reflow
of solder interconnect and underfill are achieved simultaneously. Additionally, no-flow …
of solder interconnect and underfill are achieved simultaneously. Additionally, no-flow …
Accurate numerical simulations of capillary underfill process for flip-chip packages
YC Cheng, YH Chen, HH Hung, SJ Hwang… - Engineering with …, 2024 - Springer
In the capillary underfill packaging process, resin with specific characteristics such as low
viscosity, high flowability, fast curing, and high reliability is utilized to fill the gaps between …
viscosity, high flowability, fast curing, and high reliability is utilized to fill the gaps between …
Symmetrical unit-cell numerical approach for flip-chip underfill flow simulation
Underfill process is a critical manufacturing process to safeguard and enhance the package
reliability of flip-chip devices. In most underfill researches, the underfill flow was primarily …
reliability of flip-chip devices. In most underfill researches, the underfill flow was primarily …
Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning
This paper investigates voiding issues in the underfilling process of ball grid array (BGA)
chip packages under various parameter settings such as chip conveyor speed, valve …
chip packages under various parameter settings such as chip conveyor speed, valve …