A survey on switching oscillations in power converters

T Liu, TTY Wong, ZJ Shen - … of Emerging and Selected Topics in …, 2019 - ieeexplore.ieee.org
High-frequency power converters enabled by wide bandgap (WBG) and silicon
semiconductor devices offer distinct advantages in power density and dynamic performance …

Methodology for wide band-gap device dynamic characterization

Z Zhang, B Guo, FF Wang, EA Jones… - … on Power Electronics, 2017 - ieeexplore.ieee.org
The double pulse test (DPT) is a widely accepted method to evaluate the dynamic behavior
of power devices. Considering the high switching-speed capability of wide band-gap …

Characterization and experimental assessment of the effects of parasitic elements on the MOSFET switching performance

J Wang, HS Chung, RT Li - IEEE Transactions on Power …, 2012 - ieeexplore.ieee.org
This paper presents a comprehensive study on the influences of parasitic elements on the
MOSFET switching performance. A circuit-level analytical model that takes MOSFET …

Performance improvement strategies for discrete wide bandgap devices: A systematic review

M Tahir, S Hu, X He - Frontiers in Energy Research, 2021 - frontiersin.org
Wide bandgap (WBG) devices are becoming increasingly popular due to their excellent
material properties. WBG devices are commercially available in discrete and module …

Experimental parametric study of the parasitic inductance influence on MOSFET switching characteristics

Z Chen, D Boroyevich, R Burgos - The 2010 International …, 2010 - ieeexplore.ieee.org
This paper presents an experimental parametric study of the parasitic indu waveform
ringing, switching loss, device stress, and electromagnetic interference. Based on the results …

Characterization and modeling of high-switching-speed behavior of SiC active devices

Z Chen - 2009 - vtechworks.lib.vt.edu
To support the study of potential utilization of the emerging silicon carbide (SiC) devices, two
SiC active switches, namely 1.2 kV, 5 A SiC JFET manufactured by SiCED, and 1.2 kV, 20 A …

Estimation, minimization, and validation of commutation loop inductance for a 135-kW SiC EV traction inverter

RSK Moorthy, B Aberg, M Olimmah… - IEEE Journal of …, 2019 - ieeexplore.ieee.org
With growing interests in low-inductance silicon carbide (SiC)-based power module
packaging, it is vital to focus on system-level design aspects to facilitate easy integration of …

Active gate driving technique for a 1200 V SiC MOSFET to minimize detrimental effects of parasitic inductance in the converter layout

P Nayak, K Hatua - IEEE Transactions on Industry Applications, 2017 - ieeexplore.ieee.org
1200 V SiC MOSFET is a suitable replacement for Si insulated gate bipolar transistors due
to its improved switching behavior. However, high di/dt and dv/dt of SiC MOSFET cause very …

Stray inductance reduction of commutation loop in the P-cell and N-cell-based IGBT phase leg module

S Li, LM Tolbert, F Wang… - IEEE Transactions on …, 2013 - ieeexplore.ieee.org
This paper proposes a novel packaging method for insulated-gate bipolar transistor (IGBT)
modules based on the concepts of P-cell and N-cell. The novel packaging reduces the stray …

Analysis of the switching speed limitation of wide band-gap devices in a phase-leg configuration

Z Zhang, W Zhang, F Wang, LM Tolbert… - 2012 IEEE Energy …, 2012 - ieeexplore.ieee.org
Advanced power semiconductor devices, especially wide band-gap devices, have inherent
capability for fast switching. However, due to the limitation of gate driver capability and the …