Copper-clad laminate. method for manufacturing the same, and printed circuit board including the same
JS Moon, SY Lee, SH Yoo - US Patent App. 13/761,613, 2014 - Google Patents
Disclosed herein are a method for manufacturing a copper-clad laminate (CCL) for a printed
circuit board, a CCL manufactured by the method, and a printed circuit board having the …
circuit board, a CCL manufactured by the method, and a printed circuit board having the …
Multi-layer wiring structure, magnetic element and manufacturing method thereof
CC Lin, YW Chen, YT Lai, CK Lin, CC Lee - US Patent 10,068,693, 2018 - Google Patents
A multi-layer wiring structure includes a first conductive structure, a second conductive
structure and an insulating layer. To manufacturing the multi-layer wiring structure, a first …
structure and an insulating layer. To manufacturing the multi-layer wiring structure, a first …