Nanoscience and nanotechnology are tremendously increasing fields of research that aim at
producing, characterizing and understanding nanoobjects and assemblies of nanoobjects …

Since the first studies in the late 1970s most of the researches on Si1− xGex nanostructures
have been motivated by their potential applications in micro, opto and nanoelectronic …

Wafer direct bonding refers to the process of adhesion of two flat mirror-polished wafers
without using any intermediate gluing layers in ambient air or vacuum at room temperature …

We experimentally demonstrate the visualization of nanoscale dislocation strain fields in a
thick silicon single crystal by a coherent diffraction imaging technique called Bragg x-ray …

Self-assembled configurations of nanostructures are expected to play an increasing role in
devices design, as an alternative to conventional microelectronics. The key limitation is the …

Strain engineering of semiconductors is used to modulate carrier mobility, tune the energy
bandgap, and drive growth of self-assembled nanostructures. Understanding strain-energy …

This paper describes an experimental setup that was developed to simultaneously perform
grazing incidence small angle X-ray scattering (GISAXS) and surface differential reflectance …

Mechanical relaxations of strained silicon on insulator (sSOI) nanostructures are studied for
the isolation and implantation processes used in transistor technology. Two model systems …

An original direct wafer bonding process has been developed to accurately control the
bonding interface twist and tilt angles between a mono-crystalline layer and a bare mono …

We have developed a method of coherent x-ray diffractive imaging to surmount its inability to
image the structure of strongly strained crystals. We used calculated models from finite …