Directed self-assembly of block copolymers for the fabrication of functional devices

C Pinto-Gómez, F Pérez-Murano, J Bausells… - Polymers, 2020 - mdpi.com
Directed self-assembly of block copolymers is a bottom-up approach to nanofabrication that
has attracted high interest in recent years due to its inherent simplicity, high throughput, low …

PMMA removal options by wet development in PS-b-PMMA block copolymer for nanolithographic mask fabrication

A Gharbi, R Tiron, P Pimenta Barros… - Journal of Vacuum …, 2015 - pubs.aip.org
In the integration flow of directed self-assembly with block copolymers (BCP), the selective
removal of one phase of the polymer with respect to the other one is an important step …

Sub-10 nm resistless nanolithography for directed self-assembly of block copolymers

M Fernández-Regúlez, L Evangelio… - … applied materials & …, 2014 - ACS Publications
The creation of highly efficient guiding patterns for the directed self-assembly of block
copolymers by resistless nanolithography using atomic force microscopy (AFM) is …

Polystyrene as a brush layer for directed self-assembly of block co-polymers

L Oria, AR De Luzuriaga, JA Alduncin… - Microelectronic …, 2013 - Elsevier
Block co-polymer (BCP) lithography is becoming an established technique for patterning
beyond optical lithography limitations. It is based on combining the intrinsic property of block …

Coarse grained molecular dynamics model of block copolymer directed self-assembly

RA Lawson, AJ Peters, PJ Ludovice… - Alternative …, 2013 - spiedigitallibrary.org
A model has been developed for the simulation of block copolymer (BCP) directed self-
assembly (DSA) based on a coarse grained polymer model that anneals using molecular …

300mm pilot line DSA contact hole process stability

M Argoud, I Servin, A Gharbi, PP Barros… - Alternative …, 2014 - spiedigitallibrary.org
Directed Self-Assembly (DSA) is today a credible alternative lithographic technology for
semiconductor industry [1]. In the coming years, DSA integration could be a standard …

Contact hole shrink by directed self-assembly: Process integration and stability monitored on 300 mm pilot line

I Servin, R Tiron, A Gharbi, M Argoud… - Japanese Journal of …, 2014 - iopscience.iop.org
The semiconductor devices dimensions continue to shrink to keep up with the ITRS
roadmap. Due to delay and extensive cost of EUV for 14 nm technology node and beyond …

PMMA removal selectivity to polystyrene using dry etch approach

A Sarrazin, N Posseme, P Pimenta-Barros… - Journal of Vacuum …, 2016 - pubs.aip.org
For sub-10 nm technologies, the semiconductor industry is facing the limits of conventional
lithography to achieve narrow dimensions. Directed self-assembly (DSA) of block …

Scaling-down lithographic dimensions with block-copolymer materials: 10-nm-sized features with poly(styrene)-block-poly(methylmethacrylate)

X Chevalier, C Nicolet, R Tiron… - Journal of Micro …, 2013 - spiedigitallibrary.org
Poly (styrene)-block-poly (methylmethacrylate)(PS-b-PMMA) block-copolymers (BCP)
systems synthesized on an industrial scale and satisfying microelectronic's requirements for …

Role of penetrability into a brush-coated surface in directed self-assembly of block copolymers

L Evangelio, M Fernández-Regúlez… - … applied materials & …, 2018 - ACS Publications
High-density and high-resolution line and space patterns on surfaces are obtained by
directed self-assembly of lamella-forming block copolymers (BCPs) using wide-stripe …