Wafer bonding is a highly effective technique for integrating dissimilar semiconductor
materials while suppressing the generation of crystalline defects that commonly occur during …

One of the primary research challenges for cadmium telluride (CdTe) solar cells is
addressing its open‐circuit voltage (VOC) deficit. While theoretical studies and single crystal …

The production of flexible monocrystalline semiconductor thin films less than a few tens of
micrometers in thickness is currently receiving huge interest in various emerging …

Silicon (Si) has been widely investigated as a feasible material for photoelectrochemical
(PEC) water splitting. Compared to thick wafer-based Si, thin Si (< 50 μm thickness) could …

A process for fabricating free-standing epitaxial silicon thin films for low-cost, high efficiency
silicon solar cells is proposed. The films are first grown (via chemical vapor deposition) on …

The major barrier for PV penetration is cost. And the single most important cost factor in
silicon technology is the wafer (≈ 35% of the module cost). Although tremendous progress …

A systematic characterization of sub-50-μm-thick, kerf-less monocrystalline Si wafers
fabricated by a controlled fracture method is presented. The spalling process introduces …

In this work, we report recent results of solar cells fabricated on silicon foils obtained by the
Stress induced LIft-off Method (SLIM)-cut technique using an epoxy stress-inducing layer …

Spalling has been proposed as a promising kerfless technique for slicing thin silicon wafers
and thus double the yield of a silicon ingot. The main challenge of spalling is to control the …

The Silicon on Dust Substrate (SDS) is a gas-to-wafer process that produces multicrystalline
silicon ribbons directly from gaseous feedstock (silane), avoiding the standard industry steps …