Polymers can be used as temporary place holders in the fabrication of embedded air gaps in
a variety of electronic devices. Embedded air cavities can provide the lowest dielectric …

Frequency and time domain models are developed for backplane (BP), printed circuit board
(PCB), and silicon interposer (SI) links using six-port transfer matrices (ABCD matrices) for …

An air-isolated through-silicon via (TSV) technique is proposed to reduce radio-frequency
(RF) losses in silicon interposers. A testbed containing air-isolated and conventional TSVs is …

Using air-gaps to replace conventional silicon dioxide as the insulators of through-silicon-
vias (TSVs) has the possibility to improve the electrical performance and some thermal …

Through-silicon vias (TSVs) with air gaps as the isolators have been developed to reduce
the TSV capacitance and to solve the reliability problems associated with thermomechanical …

Using air-gaps instead of conventional silicon dioxide as the insulations of TSV has the
potential to improve the electrical performance and solve some thermal reliability issues of …

Through-silicon-vias (TSVs) with air-gap insulators have the advantages of low capacitance
and low thermal stress. This paper reports the design, fabrication, and characterization of …

The use of air gaps instead of SiO 2 as insulators for through-silicon vias (TSVs) has been
demonstrated to reduce the thermal stresses and the TSV capacitance of a 3-D integrated …

Polymer dielectrics have been used as build-up layers in 2.5 D interposers with multiple
redistribution layers (RDL). To achieve high interconnection densities with good electrical …

In this study, we are pursuing an ultra low-loss interconnect pathway for 3D chip-chip
connectivity, incorporating air-clad planar interconnects, air-clad TSVs, and gradual vertical …