ST Becker, MC Smayling, D Gandhi, J Mali… - US Patent …, 2014 - Google Patents
H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components …
From the Publisher: This text treats the physical design of very large scale integrated circuits gradually and systematically. It examines the design problem and the design process with …
ST Becker, MC Smayling - US Patent 8,759,882, 2014 - Google Patents
H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components …
MC Smayling, ST Becker - US Patent 9,159,627, 2015 - Google Patents
A linear-shaped core structure of a first material is formed on an underlying material. A layer of a second material is con formally deposited over the linear-shaped core structure and …
S Teig, JL Ganley - US Patent 7,055,120, 2006 - Google Patents
23 Design Automation Conference, 1986, pp. 708–714. Fang, S. et al., Constrained Via Minimization with Practical Considerations for Multi-Layer VLSI/PCB Routing Prob lems, 28." …