A Method to Isolate Intrinsic HCD and NBTI Contributions Under Self Heating During Varying VG/VD Stress in GAA Nanosheet PFETs

N Choudhury, S Mahapatra - IEEE Transactions on Electron …, 2022 - ieeexplore.ieee.org
Gate-all-around stacked nano-sheet (GAA-SNS) p-channel field effect transistors (FETs)
having varying sheet widths are utilized for ultrafast measurements (delay) of negative bias …

A Generic Framework for MOSFET Reliability—Part II: Gate and Drain Stress—HCD

S Mahapatra, H Diwakar, K Thakor… - … on Electron Devices, 2023 - ieeexplore.ieee.org
The Reaction Diffusion Drift (RDD) model is incorporated in the Sentaurus Technology CAD
(TCAD) framework and coupled with carrier and lattice heating to calculate the generation of …

A Comprehensive Framework for the Self-Heat Enhanced BTI and HCD Isolation

R Saikia, N Choudhury, AS Bisht… - IEEE Transactions on …, 2024 - ieeexplore.ieee.org
Contributions due to bias temperature instability (BTI) and hot carrier degradation (HCD) in
the presence of self-heating (SH) on parametric shift are analyzed in gate-all-around …