Purpose–The purpose of this paper is to present a detailed overview of the current stencil
printing process for microelectronic packaging. Design/methodology/approach–This paper …

In this paper, we introduce an automated Bayesian visual inspection framework for printed
circuit board (PCB) assemblies, which is able to simultaneously deal with various shaped …

The stencil printing of solder paste is affected by a large number of factors, including printer
settings, stencil aperture geometry, and environmental conditions. A fractional factorial …

In this paper we introduce a probabilistic approach for optical quality checking of solder
pastes (SP) in Printed Circuit Boards (PCB). Dealing with unregistered image inputs, our …

Solder paste is used for reflow soldering of Surface Mount Devices (SMDs). In this paper we
discuss how the various stages of the stencil printing cycle affect the rheological properties …

In the mass assembly of today's electronic circuits, solder paste is first printed onto the
surface of the assembly boards through a metal mask called a stencil. The possible surface …

The solder paste printing process is an important process in the assembly of Surface Mount
Technology (SMT) devices using the reflow soldering technique. There is a wide agreement …

Surface mount technology (SMT) involves the printing of solder paste on to printed circuit
board (PCB) interconnection pads prior to component placement and reflow soldering. This …

The need for a better understanding of the solder paste printing process is argued.
Similarities and differences between on-contact stencil printing of solder pastes and off …

The paper presents a numerical model of screen reaction force in the 3D additive screen
printing. The 3D additive screen printing is a multilayer high-precision stereoscopic printing …