A Critical review on reliability and short circuit robustness of silicon carbide power MOSFETs

S Sreejith, J Ajayan, SB Devasenapati, B Sivasankari… - Silicon, 2023 - Springer
Superior electrical and physical properties of SiC (Silicon Carbide) make them ideal for
various high voltage, high frequency and high power electronic applications. When …

2.5 A/mm/350 GHz aggressively scaled gate engineered Fe-doped AlN/GaN channel HEMT with graded InGaN Backbarrier on SiC-wafer for next generation RF …

B Mounika, J Ajayan, S Bhattacharya - Materials Science and Engineering …, 2024 - Elsevier
This study intends to investigate the effects of barrier scaling, a crucial RF GaN-HEMT
design element, which is imperative to achieve enhanced performance at nano-scale …

Investigation on effect of AlN barrier thickness and lateral scalability of Fe-doped recessed T-gate AlN/GaN/SiC HEMT with polarization-graded back barrier for future …

B Mounika, J Ajayan, S Bhattacharya, D Nirmal… - Microelectronics …, 2023 - Elsevier
In this study, the influence of AlN barrier thickness (tb) on the RF & DC performances of 50
nm recessed T-gate Fe-doped AlN/GaN/SiC HEMT is investigated. The proposed HEMT …

A Review of GaN Channel-Based MOSHEMTs for Next-Generation Medium/Low-Voltage Rating and High-Speed RF Power Applications

G Deshpande, S Bhattacharya, J Ajayan… - Journal of Electronic …, 2024 - Springer
This comprehensive review delves into the intricate realm of GaN-based metal–oxide–
semiconductor (MOS) high-electron-mobility transistors (HEMTs), providing an exhaustive …

Design and simulation of T‐gate AlN/β‐Ga2O3 HEMT for DC, RF and high‐power nanoelectronics switching applications

R Singh, GP Rao, TR Lenka… - … Journal of Numerical …, 2024 - Wiley Online Library
In this paper, we report DC and RF analysis of a T‐gate AlN/β‐Ga2O3 high electron mobility
transistors (HEMTs) by optimizing the gate‐drain distance (L GD) and two T‐gate …

Development of Diamond Device-Level Heat Spreader for the Advancement of GaN HEMT Power and RF Electronics

MC Lu - IEEE Transactions on Device and Materials Reliability, 2023 - ieeexplore.ieee.org
Wide bandgap power electronics have been commercialized for many applications. Gallium
nitride (GaN) high electron mobility transistor (HEMT) has superior performance in high …

An intensive study on effects of lateral scaling and gate metals on the RF/DC performance of recessed T-gated Fe-doped AlN/GaN/SiC HEMTs for future RF and …

B Mounika, J Ajayan, S Bhattacharya - Microelectronic Engineering, 2023 - Elsevier
In this simulation work, the effect of Al x Ga 1-x N and In x Ga 1-x N back barriers (BB) on the
RF & DC performances of recessed T-gated Fe-doped AlN/GaN/SiC HEMT device is …

Investigation on impact of AlxGa1-xN and InGaN back barriers and source-drain spacing on the DC/RF performance of Fe-doped recessed T-gated AlN/GaN HEMT on …

B Mounika, J Ajayan, S Bhattacharya - Micro and Nanostructures, 2023 - Elsevier
The work function (φ m) of gate metal is crucial to electrical characteristics in standard GaN-
based high electron mobility transistors (HEMTs). In this simulation report, RF & DC …

Investigation of back barrier material effects on the scalability of Fe-doped recess-gated AlN/GaN HEMTs for next generation RF power electronics

B Mounika, J Ajayan, S Bhattacharya, D Nirmal - Micro and Nanostructures, 2022 - Elsevier
GaN HEMTs (high-electron-mobility transistors) on SiC (silicon carbide) wafer with back
barrier structures have gained much attention owing to the improved sheet charge density …

Strain-induced enhancement of 2D electron gas density in AlGaN/GaN heterojunction: a first-principles study

Y Cao, Q Guan, Y He, X Wang, L Zhang… - Journal of Physics D …, 2024 - iopscience.iop.org
In this study, we investigated the impact of strain on the electronic structure and polarization
of Al x Ga 1− x N and AlGaN/GaN heterojunctions using first-principles density functional …