Interaction effect between electromigration and microstructure evolution in BGA structure Cu/Sn-58Bi/Cu solder interconnects
HB Qin, W Yue, CB Ke, MB Zhou… - 2014 15th …, 2014 - ieeexplore.ieee.org
Dimension of solder interconnects (or joints) and pitches has been continuously scaling
down, resulting in inhomogeneous microstructure and severe electromigration (EM) effect in …
down, resulting in inhomogeneous microstructure and severe electromigration (EM) effect in …
The mechanical and physical properties of the phases in the microstructure of Sn-Bi solder alloy
C Lei, X Luan, Z Liu, H Qin, B Hou… - 2021 22nd International …, 2021 - ieeexplore.ieee.org
In this study, Sn58Bi solder alloy and solid solution samples of Sn-rich phase and Bi-rich
phase were prepared, and their mechanical and physical properties were tested. The elastic …
phase were prepared, and their mechanical and physical properties were tested. The elastic …