Thermal conductivity is critical to the stable operation, service life and reliability of electronic
equipment. Solving thermal management problems in electronic devices requires the …

In the 21st-century era of electronics and the digital world, electronic gadgets are handy
worldwide, and routine life without utilizing these gadgets is difficult. Compact size and …

Abstract Two-dimensional (2D) boron nitride nanosheets (BNNS), with exceptional
thermoconductive properties and wide band gap, hold a great promise as candidate fillers …

The synergistic effect cooperation of hybrids composed of 2D materials and metal
nanoparticles have been studied extensively due to their exotic properties leading to various …

Flexible dielectrics with large dielectric constant (ε′) coupled with low loss are highly
pursued in many applications. To bolster the ε′ of raw Zn (zinc)/poly (vinylidene fluoride …

In order to synchronously improve dielectric permittivity (ε′), breakdown strength (E b), and
thermal conductivity (TC) while inhibiting dissipation factor (tan δ) of raw Zn (Zinc)/PVDF …

Abstract Poly-(meta-phenylene isophthal-amide)(PMIA) is regarded as an ideal insulating
medium for electronic devices owing to its excellent chemical stability and breakdown …

The development of modern microelectronic devices and chip integration cause electronics
devices to generate excessive heat. To overcome such challenges in the near future …

A feasible technology for fabricating flexible, high-strength, and multifunctional state-of-the-
art thermal management materials is proposed. Strong intermolecular hydrogen bonding …

Polymer dielectrics have received increasing attention owing to their wide applications in
electrical, microelectronic and energy storage fields. However, it remains a challenging to …