With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder
has attracted wide attention due to its excellent comprehensive performance and low cost. In …

As the most common of the intermetallic compounds (IMCs) formed between Sn-based
solders and Cu substrates during the packaging of integrated circuits (ICs), Cu 6 Sn 5 is …

The composition of alloying elements in Sn-rich solder plays a pivotal role in determining the
performance of solder joints in an electronic package. Recently, Indium (In) has attracted …

Microalloying, in which the solidification structure is preferably and significantly modified by
trace elements, is a key method for improving Pb-free interconnections in electronic devices …

The phase stability, elastic properties, fracture toughness, electronic structure and thermal
conductivity of Ni-doped η'-Cu 6 Sn 5 have been obtained using first-principles calculations …

The directional coefficient of thermal expansion (CTE) of intermetallics in electronic
interconnections is a key thermophysical property that is required for microstructure-level …

The restriction of using toxic and harmful Sn-Pb solders has led to the rapid development of
lead-free solders in recent decades. This research on the effect of indium (In) microalloying …

Cu 6 Sn 5 is a critical intermetallic compound in soldering and three-dimensional integrated
circuit packaging technology and exists in at least five different crystal structures in the solid …

Most micro-electro-mechanical systems (MEMS) devices contain fragile moving parts, which
poses challenges in process integration of interconnection methods requiring wet-chemistry …

In this paper, based on the crystallographic characteristics of η-Cu 6 Sn 5, a 1× 1× 5
supercell was constructed, and Ni atom was doped into each of the eight Cu2 sites …