A review of research trends in microwave processing of metal-based materials and opportunities in microwave metal casting

RR Mishra, AK Sharma - Critical Reviews in Solid State and …, 2016 - Taylor & Francis
Microwave processing of materials has emerged as a new method for processing of a
variety of materials in the recent years. Microwaves have been used effectively with …

A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics

M Bharath Krupa Teja, A Sharma, S Das… - Journal of Materials …, 2022 - Springer
Lead-free solder research has witnessed a great jump in the past decades due to the
increased restrictions over the use of toxic lead-bearing solder alloys. Among the …

Microwave sintering of ceramic reinforced metal matrix composites and their properties: a review

SAA Alem, R Latifi, S Angizi… - Materials and …, 2020 - Taylor & Francis
By developing the applications of metal matrix composites (MMCs), employing more efficient
fabrication methods seems necessary. Within the two last decades, microwave (MW) …

[HTML][HTML] Microwave hybrid heating for lead-free solder: A review

M Said, NA Salleh, MFM Nazeri, H Akbulut… - Journal of Materials …, 2023 - Elsevier
This paper aims to focus on the current developments of Microwave Hybrid Heating (MHH)
as a promising alternative method in soldering, characterization of solder joint properties …

[HTML][HTML] Effect of microwave hybrid susceptors on the interface morphology, mechanical properties and fracture morphology of Cu/nano-Sn-3.0 Ag-0.5 Cu/Cu joints

S Zhang, H Zhou, T Ding, W Long, S Zhong… - Journal of Materials …, 2024 - Elsevier
The utilization of microwave hybrid heating in the field of low-temperature joining presents a
notable benefit of delivering both selective and uniform heating, a feature that is not …

Development of SnAg-based lead free solders in electronics packaging

L Zhang, C He, Y Guo, J Han, Y Zhang… - Microelectronics …, 2012 - Elsevier
Lead free solder alloys for electronic assembly is being driven by environmental and health
concerns regarding toxicity of lead and, more importantly, by the perceived economic …

Novel SiC nanoparticles-containing Sn–1.0 Ag–0.5 Cu solder with good drop impact performance

AA El-Daly, A Fawzy, SF Mansour, MJ Younis - Materials Science and …, 2013 - Elsevier
In this study, the SiC nanoparticles were successfully fabricated by high energy ball milling.
Mechanical mixing technique has been used to disperse nanometric SiC in Sn–1.0 Ag–0.5 …

Influence of dual ceramic nanomaterials on the solderability and interfacial reactions between lead-free Sn-Ag-Cu and a Cu conductor

DH Jung, A Sharma, JP Jung - Journal of Alloys and Compounds, 2018 - Elsevier
This study examined the addition of dual ceramic nanomaterials, TiO 2 and graphene (0,
0.03, 0.12, 0.21, and 0.60 wt%), to a lead-free Sn-3.0 wt% Ag-0.5 wt% Cu (SAC305) solder …

A review on heating mechanism, materials and heating parameters of microwave hybrid heated joining technique

S Zhang, Q Qiu, C Zeng, KW Paik, P He… - Journal of Manufacturing …, 2024 - Elsevier
Recent microwave hybrid heating (MHH) is environmentally benign and cost-effective, and
may increase manufacturing product quality. MHH has attracted interest from materials …

Effect of TiO2 additions on Sn-0.7 Cu-0.05 Ni lead-free composite solder

MII Ramli, N Saud, MAAM Salleh, MN Derman… - Microelectronics …, 2016 - Elsevier
The effect of TiO 2 addition on the microstructure, melting behavior, microhardness and
interfacial reaction between Sn-0.7 Cu-0.05 Ni and a Cu-substrate were explored. Samples …