Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management
JS Gandhi, H Liu, TY Lee, G Refai-Ahmed… - US Patent …, 2020 - Google Patents
Methods and apparatus are described for heat management in an integrated circuit (IC)
package using a lid with recessed areas in the inner surfaces of the lid. The recessed areas …
package using a lid with recessed areas in the inner surfaces of the lid. The recessed areas …
Thermal interface material having different thicknesses in packages
SH Huang, DC Yu, KY Huang, PY Li… - US Patent 10,707,177, 2020 - Google Patents
A package includes a package component, a device die over and bonded to the package
component, a metal cap having a top portion over the device die, and a thermal interface …
component, a metal cap having a top portion over the device die, and a thermal interface …
Thermal interface material having different thicknesses in packages
SH Huang, DC Yu, KY Huang, PY Li… - US Patent 10,770,405, 2020 - Google Patents
A package includes a package component, a device die over and bonded to the package
component, a metal cap having a top portion over the device die, and a thermal interface …
component, a metal cap having a top portion over the device die, and a thermal interface …
Semiconductor device package with warpage control structure
MC Yew, FJ Li, PY Lin, KC Liu - US Patent 9,831,190, 2017 - Google Patents
Between an adhesive surface of a heat spreader lid and a top surface of a semiconductor
package, in addition to a spreader adhesive layer, several warpage control adhesive layers …
package, in addition to a spreader adhesive layer, several warpage control adhesive layers …
Adhesive sealing of thermal interface materials
KT Wu, DA Pipho, K Voss - US Patent App. 16/323,090, 2019 - Google Patents
In one example, an apparatus is described, which includes an electronic component, a
thermal dissipation unit, a thermal interface material disposed between the electronic …
thermal dissipation unit, a thermal interface material disposed between the electronic …
Semiconductor device package with warpage control structure
MC Yew, FJ Li, PY Lin, KC Liu - US Patent 10,685,920, 2020 - Google Patents
Between an adhesive surface of a heat spreader lid and a top surface of a semiconductor
package, in addition to a spreader adhesive layer, several warpage control adhesive layers …
package, in addition to a spreader adhesive layer, several warpage control adhesive layers …
Semiconductor device and method of manufacture
US10109547B2 - Semiconductor device and method of manufacture - Google Patents
US10109547B2 - Semiconductor device and method of manufacture - Google Patents …
US10109547B2 - Semiconductor device and method of manufacture - Google Patents …
Thermal interface materials with adhesive selant for electronic components
KT Wu, DA Pipho, K Voss - US Patent 11,031,319, 2021 - Google Patents
In one example, an apparatus is described, which includes an electronic component, a
thermal dissipation unit, a thermal interface material disposed between the electronic …
thermal dissipation unit, a thermal interface material disposed between the electronic …
Method for forming a lid structure for a semiconductor device package
HO Kuan-Lin, CL Chen, CY Yu, YC Liu - US Patent 10,157,863, 2018 - Google Patents
(57) ABSTRACT A semiconductor device structure and method for forming the same are
provided. The semiconductor device structure includes a substrate and a die structure …
provided. The semiconductor device structure includes a substrate and a die structure …
EMI shielding for flip chip package with exposed die backside
SW Cho, C Kim, IK Shim, I Yoon, KH Park - US Patent 11,715,703, 2023 - Google Patents
A semiconductor device has a substrate and a semiconductor die disposed over the
substrate. An encapsulant is deposited over the semiconductor die and substrate with a …
substrate. An encapsulant is deposited over the semiconductor die and substrate with a …