Remote Epitaxy: Fundamentals, Challenges, and Opportunities

BI Park, J Kim, K Lu, X Zhang, S Lee, JM Suh… - Nano …, 2024 - ACS Publications
Advanced heterogeneous integration technologies are pivotal for next-generation
electronics. Single-crystalline materials are one of the key building blocks for heterogeneous …

GaN remote epitaxy on a pristine graphene buffer layer via controlled graphitization of SiC

S Lee, J Kim, BI Park, HI Kim, C Lim, E Lee… - Applied Physics …, 2024 - pubs.aip.org
Freestanding semiconductor membranes hold significant potential for heterogeneous
integration technology and flexible electronics. Remote epitaxy, which leverages …

Plasma enhanced chemical vapor deposition method prepared n-type GaN films for chips

Q Liang, H Xu, W Wu - Available at SSRN 4925408 - papers.ssrn.com
N-type GaN films for chip have been successfully prepared by simple, safe and low-cost
plasma enhanced chemical vapor deposition method at 925 C for different N2 flow rate. The …