The diamond wire sawing is superior for the wafers manufacturing in the photovoltaic and
semiconductor industry. In this research, analytical models were emphasized and …

Hard and brittle materials such as monocrystalline silicon still occupy an important position
in the semiconductor industry, but hard and brittle materials are difficult to process because …

Wire bow is the most important factor affecting wire sawing capability of silicon ingots. In this
paper, the wire bow, contact length in cutting zone which reflects the DWS process are …

At present, the diamond wire sawing technology has been widely used in the slicing of
photovoltaic multi-crystal silicon (mc-Si). The diameter of diamond saw wire becomes …

This study aimed to evaluate and better understand the mechanical and crystalline
responses of polycrystalline silicon sawn by diamond wire sawing. To simplify the multi-wire …

Ultrathin wafer slicing with low kerf loss for electroplated diamond wire sawing is the primary
means to improve the productivity in wafering and reduce the manufacturing costs in the …

Fixed diamond wire has been the most common tool for slicing semiconductor ingots into
wafers in fields of photovoltaics and integrated circuits. The diameter of diamond wire and …

As the photovoltaic industry needs to reduce manufacturing costs, the kerf loss and the wafer
thickness of diamond wire slicing will be further reduced in the future, which will make the …

The present study recommends sawing thin (120 μm) silicon (Si) wafers using thin (120 μm)
diamond wire with higher throughputs and sawing yields (> 96%). In a multi-wire saw, an …

This paper investigates the effect of scribing speed on the surface morphology and material
removal behavior in diamond wire sawing of monocrystalline silicon through specially …