BACKGROUND This invention generally relates to circuit materials, meth ods for the
manufacture of the circuit materials, and articles formed therefrom, including circuits and …

B29C 70/58(2006.01) C08K 3/22(2006.01) C08K 3/36(2006.01) B29C 70/88(2006.01) HOIB
3/44(2006.01) HOIB 3/42(2006.01) C08K 7700(2006.01) C08K 3/10(2018.01) HOIB …

Polymeric compositions Suitable for use as insulation mate rials in electrical applications.
Such polymeric compositions comprise an ethylenefol-olefin-based elastomer and a filler …

(57) ABSTRACT Related US Application Data (60) Provisional application No. 63/126,111,
filed on Dec. 16, 2020. The present disclosure relates to a copper-clad laminate that may …

Disclosed are resin compositions that include poly (arylene ether), HIPS/GPPS), impact
modifier, and ceramic filer that provide various Dk values while maintaining Df at a very low …

The present disclosure relates to a dielectric substrate that may include a polyimide layer
and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may …

A thermosetting polymer formulation includes: 40 to 90 volume percent of a thermosetting
polymer system; 10 to 40 volume percent, preferably 20 to 35 volume percent, preferably 20 …

(57) ABSTRACT A composite material, a high-frequency circuit baseboard made therefrom
and a production method thereof. The composite material comprises: a dispersed emulsion …

B32B15/04—Layered products comprising a layer of metal comprising metal as the main or
only constituent of a layer, which is next to another layer of the same or of a different …

US11930596B2 - Materials for printed circuit boards - Google Patents US11930596B2 - Materials
for printed circuit boards - Google Patents Materials for printed circuit boards Download PDF …