Ultrahigh Aspect Ratio Through Glass Vias Perforation Utilizing Selective Laser‐Induced Etching with Nanochannels
J Liu, C Xia, X Ming, G Dou… - Advanced Engineering …, 2024 - Wiley Online Library
At present, perforation of high aspect ratio through glass vias (TGVs) is one of the primary
factors limiting the development of glass interposers. Herein, it is based on a large number …
factors limiting the development of glass interposers. Herein, it is based on a large number …
Ultrahigh Aspect Ratio Through Glass Vias Perforation Utilizing Selective Laser‐Induced Etching with Nanochannels
J Liu, C Xia, X Ming, G Dou… - Advanced Engineering …, 2024 - Wiley Online Library
At present, perforation of high aspect ratio through glass vias (TGVs) is one of the primary
factors limiting the development of glass interposers. Herein, it is based on a large number …
factors limiting the development of glass interposers. Herein, it is based on a large number …