(57) ABSTRACT A heat sink assembly includes a heat sink (10), a fan cover (20) mounted
on the heatsink and a fan (30) carried by the fan cover. The heat sink comprises a base (12) …

A heat sink includes a thermally conductive base, a plurality of thermally conductive fins
extending from the base, and a guiding member. The base has a top surface from which the …

An electronic device includes a bottom plate, a circuit board having an electronic
component, a fan, and an airflow guide member. The circuit board is fixed to the bottom …

An integrated heat dissipation device includes a heat sink portion having a base with a
plurality of posts formed thereon, a fin portion with a plurality of stacked fins, individually …

A cooling device includes a heat sink (10), a fan (30), and a fan duct (50) covering the heat
sink and fan therein. The heat sink includes a base (12) defining at least a through hole (18) …

A heat dissipation module includes a heat sink (40) mountable above a heat-generating
component, a fan duct (10), and a fan (50). The fan duct accommodating the heat sink …

A heat dissipation device includes a heat sink, a fan adapter and a fan. The fan adapter has
two opposing sidewalls straight arranged thereof, a top wall disposed horizontally and …

An airflow guide structure and manufacture thereof is used to allow components of an airflow
guide are cut by molds in a factory to form thin plates in each of which has a plurality of …

An integrated heat-dissipating module includes a heat dissipating device Substantially in
contact with a main heat-generating Source on a motherboard, a casing capping over the …

According to one embodiment, a cooling device includes a cooling fan, a heat sink, an
inserting portion, a projection, and a holder. The inserting portion is provided on one of the …