A novel silver–aluminium high-temperature die attach nanopaste system: the effects of organic additives content on post-sintered attributes

VR Manikam, KA Razak, KY Cheong - Journal of Materials Science …, 2013 - Springer
Abstract An Ag–Al die attach material having a fixed Ag–Al nanoparticles weight percent
content (80–20%), as well as varying organic additives weight percent content was …

Physical and electrical attributes of sintered Ag80–Al20 high temperature die attach material with different organic additives content

VR Manikam, KA Razak, KY Cheong - Journal of Materials Science …, 2013 - Springer
In this work, the primary focus was to establish a relationship between the post-sintered
physical attributes of the high temperature Ag 80–Al 20 die attach material and its electrical …

Study of Copper-Aluminium High Temperature Die-Attach Material with Different Aluminium Weight Percentage

SK Ping - 2017 - search.proquest.com
High temperature die attach material has excellent corrosion resistance, good ductility, good
electrical volume resistivity. Therefore, die attach materials have been introduced for …

Study of copper-aluminium high temperature die-attach material with different aluminium weight percentage/Shiu Kai Ping

KP Shiu - 2017 - studentsrepo.um.edu.my
High temperature die attach material has excellent corrosion resistance, good ductility, good
electrical volume resistivity. Therefore, die attach materials have been introduced for …

[PDF][PDF] Vemal Raja Manikam, Khairunisak

A Razak, KY Cheong - J Mater Sci: Mater Electron, 2013 - researchgate.net
Abstract An Ag–Al die attach material having a fixed Ag–Al nanoparticles weight percent
content (80–20%), as well as varying organic additives weight percent content was …