This article presents transmission line-based capacitively coupled resonator matching
techniques for THz amplifiers and demonstrates the idea in a three-stage differential H-band …

The performance of WR-3.4 overmoded waveguide modules containing a linear array of
discrete terahertz integrated circuits is presented to verify a new power-combining …

This article introduces the packaging and integration of a multichannel silicon-based power
amplifier (PA) operating in the range of 70–74 GHz into a metal waveguide (WG) using a …

This paper introduces a WR‐3.4 waveguide module that contains an array of circuits
fabricated on a single chip with an area of 3× 0.75 mm2. The array comprises ten elements …

This article presents a metallic radiator module, cm3 in size, designed to direct terahertz
power with a 26° circularly symmetric radiation beam. The module combines the power from …

This letter presents an innovative inline waveguide-to-chip transition for MMIC packaging.
The design proposes a Y-shaped quasi-Yagi antenna concept, which aims to enhanced …

In this paper, two identical fixed-frequency oscillators for WR-3.4 band (220–320 GHz) are
fabricated for RF-probe tests and for waveguide packaging. The oscillator is designed …