Portable electronic products are continuously evolving towards compactness, integration,
and high performance, resulting in electronic chips generating significant heat in a confined …

The increasing heat flux of electronic systems, caused by the miniaturization and high
integration, has posed a huge challenge to efficient and effective thermal management …

In this work, a novel biporous spiral woven mesh wick is developed to enhance the thermal
performance of an ultra-thin flattened heat pipe for cooling high heat flux electronic devices …

Electronic devices with high heat flux are currently facing heat dissipation problems. Heat
pipes can be used as efficient heat spreaders to address this critical problem. However, as …

Heat pipe cooling for battery thermal management systems (BTMSs) in electric vehicles
(EVs) is growing due to its advantages of high cooling efficiency, compact structure and …

MEMS-based micro heat pipes (MHPs), as a novel heat pipe technology, is considered a
promising choice for thermal management applications in microelectronic circuits …

With the development of modern microelectronics technology, electronic chips are
constantly evolving towards high performance, miniaturization and integration, which …

With the increasing heat flux required in portable electronic devices, ultra-thin vapour
chambers (UTVCs) have attracted increasing attention as efficient phase-change heat …

The thermal performance of a copper-water flat heat pipe (100 mm× 50 mm× 2 mm)
composed of a novel wick structure with an inner thickness for working fluid less than 1 mm …

The efficiency and heat transfer characteristics of a newly designed flat polymer heat pipe
that uses copper micro thermal via was investigated using a fabricated laboratory model to …