The planned introduction of porous, low-k dielectric materials into Si-based semiconductor
devices will provide substantial challenges for chemical mechanical planarization. These …

An electrochemical planarization apparatus for planarizing a metallized surface on a
workpiece includes a polishing pad and a platen. The platen is formed of conductive …

Polishing compositions and methods for removing conduc tive materials from a substrate
surface are provided. In one aspect, a composition includes an acid based electrolyte …

A method of production and a method of polishing a semiconductor device and a polishing
apparatus, capable of easily flattening an initial unevenness of a metal film, excellent in …

The invention relates to a method of polishing a substrate comprising at least one metal
layer by applying an electro chemical potential between the substrate and at least one …

(57) ABSTRACT A method and apparatus for removing conductive material from a
microelectronic Substrate. In one embodiment, the method can include engaging a …

US7160176B2 - Methods and apparatus for electrically and/or chemically-mechanically
removing conductive material from a microelectronic substrate - Google Patents …

An electrolyte composition and method for planarizing a surface of a wafer using the
electrolyte composition is provided. In one aspect, the electrolyte composition includes …

Electrolyte compositions and methods for planarizing a Surface of a Substrate using the
electrolyte compositions are provided. In one aspect, an electrolyte composition includes …

(54) METHOD AND COMPOSITION FOR 10/032,275, filed on Dec. 21, 2001, now Pat. No.
POLISHINGA SUBSTRATE 6,899,804, application No. 11/196,876, which is a continuation …