Miniaturization as well as manufacturing processes that electronics devices are subjected to
often results in to increase in operational parameters such as current density, temperature …

Abstract The reliability of Sn-Ag-Cu (SAC)-based solder alloys has been extensively
investigated after the prohibition of lead in the electronics industry owing to their toxicity. Low …

Solder joints are subjected to varied stress cycle circumstances in the electronic packaging
service life but are also influenced by aging. There has been limited investigation into the …

One of the crucial factors in evaluating the reliability of an electronic appliance is fatigue
failure of the interconnecting solder joints. In most situations, large bulk samples are used to …

One of the crucial factors in determining the reliability of an electronic device is fatigue
failure of the interconnecting solder joints. In most cases, large bulk samples are used to …

Reliability of the microelectronic interconnection materials for electronic packages has a
significant impact on the fatigue properties of the electronic assemblies. This is due to the …

In realistic applications, the solder joint is continually subjected to thermal-mechanical stress
due to the difference in the coefficient of thermal expansion (CTE) between the printed circuit …

Soldered micro-electronics assemblies may have to survive a variety of mechanical loads in
repeated drops, cyclic bending, or vibration. A very large body of work has addressed the …

Electronic assemblies are continually subjected to thermal–mechanical stres, leading to
failure mainly due to creep and fatigue mechanisms. The reliability of the assembly may be …

There is a growing interest in low temperature soldering, yet the use of low-melting point
alloys for interconnection is often hindered by reliability concerns. Eutectic tin-bismuth (SnBi) …