Electrode contact interfaces for practical thermoelectric (TE) devices require high bonding
strength, low specific contact resistivity, and superb stability. Herein, the state‐of‐the‐art …

Due to the uncertainty of the brazing solder composition and its unknown effect on the long-
term stability of the interface, the brazing interface connection process for half-Heusler (hH) …

In addition to the thermal and electrical characteristics of the thermoelectric material, the
energy conversion efficiency of TE devices is influenced by other factors including the …

In this study we investigated the nature and stability of the interfaces between Mg 2.05 Si
0.98 Bi 0.02 as the TE material and Ni and Mg 50 Si 15 Ni 50 as barriers. Single-leg devices …

Magnesium silicide stannide solid solutions, Mg2 (Si, Sn), are prominent materials in the
development of devices for thermoelectric energy conversion for intermediate operating …

Mg2SiNi3, is a topologically densely packed intermetallic compound (TCP-IMC) and an
excellent diffusion barrier material between nickel and Mg2Si-based thermoelectric material …

The need for clean energy sources led researchers to increase their research on promising
and non-fossil sources, such as thermoelectric materials, and torus this study we put the …

A thermoelectric module is composed of n-and p-type materials, and its performance is
evaluated by the materials' dimensionless figure of merit, zT, which is expected to be as high …