Dielectric materials with high thermal conductivity (TC) can enable disruptive performance
enhancement in the areas of electronics packaging, thermal management, energy storage …

Gate-open failures in power semiconductors occur when the gate-bond wire cracks or lifts-
off leading to loss of gate control. In molded discrete devices, this failure mode may occur …

Electrical interconnects play important roles in both the performance and reliability of
integrated circuits. As the operating frequency has increased and products have been …

Insulated gate bipolar transistor (IGBT) power modules are devices commonly used for high-
power applications. Operation and environmental stresses can cause these power modules …

The power electronics industry is continuously striving to improve the efficiency and density
of power converters. At the same time, with increasing electrification and automation across …

This research paper addresses the current gap in understanding the intricate damage types
within packaged integrated circuits (ICs). We introduce a novel multiscale latent low-rank …