(Continued) Primary Examiner—Eliseo Ramos Feliciano Assistant Examiner—Ankush K
Singal (74) Attorney, Agent, or Firm—Fish & Richardson PC (57) ABSTRACT Integrated …

An apparatus for transferring a semiconductor die from a wafer tape to a product substrate.
The apparatus includes a wafer frame configured to hold the wafer tape and a support frame …

An apparatus includes a needle including a hole extending from a first end to a second end
through the needle and an energy-emitting device arranged in the hole of the needle. The …

An apparatus includes a needle and a needle actuator to move the needle to a position at
which the needle presses an electrically-actuatable element into contact with a circuit trace …

Integrated active-matrix multi-color light emitting pixel arrays based displays and methods of
fabricating the inte grated displays are provided. An example integrated device includes a …

An apparatus includes a substrate and a circuit trace having a predetermined pattern
disposed on the substrate. A plural ity of LEDs are connected to the substrate via the circuit …

An apparatus that directly transfers a semiconductor device die from a first substrate to a
second substrate. The semi conductor device die is disposed on the first side of the first …

LEDs. Each LED is attached to the substrate via conductive pads on a side of the LED. A
diffuser having light diffusing characteristics is aligned with the plurality LEDs against a …

(57) ABSTRACT A system to transfer an unpackaged die directly from a die holding
substrate to a transfer location on a secondary substrate. The system includes a die …

(57) ABSTRACT A lighting component including a plurality of die transferred to the glass
substrate. The transfer occurs by positioning the glass substrate to face a first surface of a …