Fluid dispensing is a method by which fluid materials, such as epoxy, adhesive, and
encapsulant, are delivered in a controlled manner in electronics packaging. This paper …

The process of time-pressure fluid dispensing has been widely employed in the
semiconductor industry, where the fluid is applied to boards or substrates. In such a process …

Fluid dispensing is one critical process in electronics packaging, in which fluid materials
(such as encapsulant, adhesive) are delivered controllably onto substrates for the purpose …

To improve the consistency of the adhesive amount dispensed by the time-pressure
dispenser for semiconductor manufacturing, a non-Newtonian fluid flow rate model is …

Dispensing is a key process in surface mount technology (SMT), in which minute amounts of
fluid materials (such as solder paste, adhesive) are delivered controllably onto printed circuit …

Time-pressure dispensing has been widely employed in electronics packaging
manufacturing, where the fluid (such as encapsulant, epoxy, adhesive, etc.) in a syringe is …

Jet-dispensing technology is increasingly applied in electronic fabrication because of its
high productivity characteristics, and these applications require a high degree of accuracy in …

Surface mount adhesives are used to hold electronic components on printed circuit boards
or substrates. When dispensed onto a surface, the adhesive dots have to meet distinctive …

This paper describes a new technique for the monitoring and automated control of the reflow
soldering process. The new technique combines state of the art infra-red (IR) sensor …

To alleviate the influence of gas compressibility on the process performance of time-
pressure dispensing for electronics encapsulation, a predictive model is developed based …