Polymer matrix composite for eliminating skew and fiber weave effect
T Amla - US Patent App. 15/956,208, 2019 - Google Patents
BACKGROUND 1. Technical Field [0002] The present disclosure relates to a polymer matrix
composite, and in particular, to a polymer matrix composite for eliminating skew and fiber …
composite, and in particular, to a polymer matrix composite for eliminating skew and fiber …
Hybrid PCB with multi-unreinforced laminate
HM Daghighian, SC Bird, GD Babel - US Patent 9,526,185, 2016 - Google Patents
(57) ABSTRACT A hybrid printed circuit board may include a top layer, a bottom layer, and a
plurality of internal layers stacked up between the top layer and the bottom layer. The …
plurality of internal layers stacked up between the top layer and the bottom layer. The …
Thermosetting resin sandwich prepreg, preparation method thereof and copper clad laminate therefrom
S Chai - US Patent App. 14/378,012, 2016 - Google Patents
SUMMARY OF THE INVENTION 0005 Directing to the technical problems to be solved by
the present invention, one of the objects of the present inven tion lies in providing …
the present invention, one of the objects of the present inven tion lies in providing …
Method for forming metal circuit, liquid trigger material for forming metal circuit and metal circuit structure
TH Kao, MC Huang, MC Chou - US Patent 9,499,911, 2016 - Google Patents
The disclosure is directed to a metal circuit structure, a method for forming a metal circuit and
a liquid trigger material for forming a metal circuit, which are capable of forming a single …
a liquid trigger material for forming a metal circuit, which are capable of forming a single …
Polymer matrix composite, prepreg and printed circuit board for eliminating skew and fiber weave effect
T Amla, YH Wu, YC Huang - US Patent App. 17/590,208, 2022 - Google Patents
The present disclosure provides a polymer matrix compos ite, and a laminate, a prepreg and
a printed circuit board using the same. The polymer matrix composite includes a polymeric …
a printed circuit board using the same. The polymer matrix composite includes a polymeric …
Metal circuit structure
TH Kao, MC Huang, MC Chou - US Patent 9,683,292, 2017 - Google Patents
A metal circuit structure is provided. The metal circuit structure includes a Substrate, a first
trigger layer and a first metal circuit layer. The first trigger layer is disposed on the substrate …
trigger layer and a first metal circuit layer. The first trigger layer is disposed on the substrate …