With the development of science and technology, consumers' requirements for various
electronic devices present a trend of more diverse functions and thinner bodies. This makes …

With the miniaturization of electronic packaging and devices, the size of solder joints in
electronics is also decreasing from bulk solder joints to micro-bumps. Both the …

The development of high density and high integration of electronic chips puts forward stricter
requirements on electronic packaging structures. Under the premise of lead-free rules, Sn …

Solder joints are generally regarded as the weakest part in packaging systems and
electronic assemblies in modern electronic products and devices. In this study, both …

Solder joint integrity has long been recognized as a key issue affecting the reliability of
integrated circuit packages. In this study, both experimental and finite element simulation …

The interfacial microstructure, shear property and fracture behaviors of Sn single bond 37Pb
joints after cryogenic temperature storage for different durations were investigated in this …

Thermomechanical fatigue damage is a progressive process of material degradation. The
objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints …

Low cycle fatigue performance of ball grid array (BGA) structure Cu/Sn–3.0 Ag–0.5 Cu/Cu
joints with different standoff heights (h, varying from 100 to 500 μm) and two pad diameters …

基于塑性应变能密度概念提出微焊点低周疲劳裂纹萌生, 扩展和寿命预测模型,
阐明其与连续介质损伤力学的联系, 评估应力三轴度对预测模型的影响, 并通过试验和数值计算 …

Low-cycle fatigue tests of Sn-Ag-Cu (SAC) Pb-free solder joints under fixed displacement
were performed to evaluate the influence of Ag content (0–3 wt.%) and solder-joint geometry …