Direct-bonded optoelectronic interconnects for high-density integrated photonics are
provided. A combined electrical and optical interconnect enables direct-bonding of fully …

A 2D hologram system with a matrix addressing scheme is provided. The system may
include a 2D array of sub-wavelength hologram elements integrated with a refractive index …

A bonded optical device is disclosed. The bonded optical device can include a first optical
element, a second optical element, and an optical pathway. The first optical element has a …

There is set forth herein a method including building an interposer base structure on a first
wafer having a first substrate, wherein the building an interposer base structure includes …

The method is provided for fabricating an optical metasur face. The method may include
depositing a conductive layer over a holographic region of a wafer and depositing a …

US11054597B2 - Electro-optical package and method of fabrication - Google Patents
US11054597B2 - Electro-optical package and method of fabrication - Google Patents …

US10976491B2 - Photonics interposer optoelectronics - Google Patents US10976491B2 -
Photonics interposer optoelectronics - Google Patents Photonics interposer optoelectronics …

Embodiments include a LIDAR scanning system. A laser is configured to emit pulses of light.
A transmit reconfigurable-metasurface is configured to reflect an incident pulse of light as an …

(57) ABSTRACT A method includes placing an electronic die and a photonic die over a
carrier, with a back surface of the electronic die and a front surface of the photonic die facing …

A multi-chip module (MCM) is described. This MCM includes a driver integrated circuit that
includes electrical circuits, a photonic chip, an interposer, and an optical gain chip. The …