An extended state-based peridynamic model for damage growth prediction of bimaterial structures under thermomechanical loading

H Zhang, P Qiao - Engineering Fracture Mechanics, 2018 - Elsevier
An extended ordinary state-based peridynamic model considering thermomechanical
loading is presented to predict damage growth of bimaterial structures, such as cermet. In …

Fatigue crack growth analysis of an interfacial crack in heterogeneous materials using homogenized XIGA

G Bhardwaj, SK Singh, IV Singh, BK Mishra… - Theoretical and Applied …, 2016 - Elsevier
In this work, the fatigue life of an interfacial cracked plate is evaluated in the presence of
flaws by homogenized extended isogeometric analysis (XIGA). In XIGA, the crack faces are …

Three-dimensional quasi-static interfacial crack growth simulations in thermo-mechanical environment by coupled FE-EFG approach

H Pathak, A Singh, IV Singh - Theoretical and Applied Fracture Mechanics, 2016 - Elsevier
This paper presents the three-dimensional interfacial crack growth simulations using
coupled finite element and element free Galerkin (FE-EFG) approach under mechanical and …

Fatigue crack growth simulations of bi-material interfacial cracks under thermo-elastic loading by extended finite element method

H Pathak, A Singh, IV Singh - European Journal of Computational …, 2013 - Taylor & Francis
In this paper, fatigue crack growth simulations of bi-material interfacial cracks have been
performed using extended finite element method (XFEM) under thermo-elastic loading. The …

Experimental analysis of the strength of silver–alumina junction elaborated at solid state bonding

B Serier, BB Bouiadjra, M Belhouari, D Treheux - Materials & Design, 2011 - Elsevier
The mechanisms of ceramics–metal assemblies, particularly silver and alumina, can be
better understood by studying the strength of their adhesion. These two materials are a priori …

A simple model for the study of the tolerance of interfacial crack under thermal load

L Ma, R He, J Zhang, B Shaw - Acta Mechanica, 2013 - Springer
Thermal stresses due to a mismatch between material properties may induce failure of a
bonded interface. A simple model for linear dissimilar elastic bonded solids containing an …

Crack propagation and deviation in bi-materials under thermo-mechanical loading

M Chama, B Boutabout, A Lousdad… - … and Mechanics, An Int'l …, 2014 - dbpia.co.kr
This paper presents a finite element based numerical model to solve two dimensional bi-
material problems. A bi-material beam consisting of two phase materials ceramic and metal …

Microstructural Evolution and Properties of Cuw/Cucr Interface Bonded with Cucrnixtizr High Entropy Alloy Interlayers

X Yang, J Liu, B Zhang, X Sun, P Xiao - Microstructural Evolution and … - papers.ssrn.com
CuW/CuCr integral materials were prepared by infiltration diffusion technology, and the multi-
component powders with high entropy effect were used as the interlayer. The effects of …

Finite element analysis of the interface defect in ceramic-metal assemblies: Alumina-Silver

B Farida, L Hadid, S Boualem… - Frattura ed Integrità …, 2020 - fracturae.com
The realization of a connection between a ceramic and a metal is always accompanied by
the creation of a multi-axial stress field. Different physical and mechanical origins explain the …

[PDF][PDF] Experimental and numerical prediction of the weakened zone of a ceramic bonded to a metal

B Zaoui, M Baghdadi, B Mechab, B Serier… - Advances in Materials …, 2019 - researchgate.net
In this study, a three-dimensional Finite Element Model has been developed to estimate the
size of the weakened zone in a bi-material a ceramic bonded to metal. The calculations …