This paper presents an inductorless wideband gain-boosted baseband (BB) amplifier
suitable for wireless network-on-chip (WiNoC) architectures. Current reuse active feedback …

3D Network-on-Chip (3D NoC) enables design of high-performance and energy-efficient
manycore computing platforms. Two of the commonly used vertical interconnection …

For the first time, this work presents a wireless-wireline hybrid 3D interconnect that employs
orthogonal simultaneous bidirectional signaling for 3D Network-on-chip to achieve 2x …

This paper presents a dual-equalization-path (DEP) near field inductive coupling link for
contactless vertical interconnect in high-performance 3D IC. The DEP receiver is …

For the first time, this work systematically develops the complete serial link by using
hierarchical modeling with serial link power and delay models. This paper presents a …

Recently emerging wearable electronics [21], such as smartwatches, health monitoring
straps, wireless earbuds, etc., as well as future low-profile devices like miniature spy robots …

To meet the ever-increasing demands of computational power, multi-core processor
integration has risen to new heights. The wireless network-on-chip is an emerging …