Reliable computationally efficient behavioral modeling of microwave passives using deep learning surrogates in confined domains

S Koziel, N Çalık, P Mahouti… - IEEE Transactions on …, 2022 - ieeexplore.ieee.org
The importance of surrogate modeling techniques has been steadily growing over the recent
years in high-frequency electronics, including microwave engineering. Fast metamodels are …

On-chip sub-terahertz surface plasmon polariton transmission lines with mode converter in CMOS

Y Liang, H Yu, J Wen, AAA Apriyana, N Li, Y Luo… - Scientific reports, 2016 - nature.com
An on-chip low-loss and high conversion efficiency plasmonic waveguide converter is
demonstrated at sub-THz in CMOS. By introducing a subwavelength periodic corrugated …

De-embedding based on EM simulation and measurement: A hybrid method

W Wang, R Jin, TS Bird, X Liang… - IEEE Transactions on …, 2017 - ieeexplore.ieee.org
We describe a hybrid de-embedding method that can achieve a good balance between
accuracy and the number of standards required. In this new approach, the characterization …

A 220-GHz compact equivalent circuit model of CMOS transistors

Y Wu, Y Hao, J Liu, K Kang - IEEE Microwave and Wireless …, 2017 - ieeexplore.ieee.org
This study presents a physical-based RF equivalent circuit model for CMOS transistors. To
increase the model accuracy and extend the effective frequency band, the interconnection …

V-band via-less GCPW-to-microstrip transition designed on PET flexible substrate using inkjet printing technology

A Chahadih, PY Cresson, C Mismer… - IEEE Microwave and …, 2015 - ieeexplore.ieee.org
In this letter, a grounded coplanar waveguide-to-microstrip (GCPW-to-MS) transition without
via holes is presented. The transition is designed on a PET® substrate and fabricated using …

De-embedding and electromagnetic simulation calibration of on-wafer passive devices for millimeter wave integrated circuit design support

Y Cao, W Zhang, J Fu, N Liu… - 2017 2nd IEEE …, 2017 - ieeexplore.ieee.org
In this paper, on-wafer de-embedding methods for passive components are evaluated for
millimeter wave integrated circuit (MMW IC) design support. An electromagnetic simulation …

Modeling the frequency-dependent series parasitics of ground–signal–ground pads used to probe on-wafer microstrip-line-fed devices

DM Cortés-Hernández… - IEEE Transactions on …, 2017 - ieeexplore.ieee.org
This paper presents a model for the parasitic series resistance and inductance of pads used
to on-wafer probing of microstrip-line-fed devices. The model accounts for the frequency …

Investigation of the de-embedding issue of CPWs on silicon substrates at high frequency

W Shu, S Shichijo… - 2013 Texas Symposium on …, 2013 - ieeexplore.ieee.org
In this paper, coplanar waveguide (CPW) transmission lines that require pads and
transitions are fabricated on 8000 Ω-cm and 15 Ω-cm silicon substrates and measured up to …

[图书][B] Study of silicon substrate properties at mm-wave and THz frequencies and their impact on passive and active devices

W Shu - 2015 - search.proquest.com
Abstract Millimeter-wave (mm-wave) complementary metal-oxide semiconductor (CMOS)
circuits have emerged because of improved device performance with silicon technology …

[图书][B] Electromechanical Response of 2D Molecule-Nanoparticle Arrays in the Gigahertz Region

MM Bolton - 2018 - search.proquest.com
Many advancements in the field of molecular electronics are still necessary before it plays
an integral part of making smaller, faster, more energy efficient, and more cost effective …