A method for the laser-based machining of a sheet-like substrate, in order to separate the
substrate into multiple portions, in which the laser beam of a laser for machining the …

The present invention relates to a laser cutting technology for cutting and separating thin
substrates of transparent materials, for example to cutting of display glass compositions …

Embodiments are directed to strengthened glass articles comprising a thickness t≤ 1 mm
(1000 μm), an inner region under a central tension CT (in MPa), and at least one …

Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent
brittle parts from substrates with particular interest in substrates formed from strengthened or …

US10118858B2 - Strengthened glass with deep depth of compression - Google Patents
US10118858B2 - Strengthened glass with deep depth of compression - Google Patents …

Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary
shape using lasers are described herein. Three general methods to produce chamfers on …

Chemically strengthened glass articles having at least one deep compressive layer
extending from a surface of the article to a depth of layer DOL of about 130 μm up to about …

Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal
line oriented along the beam propagation direction and directed into the material, the laser …

Glass-based article including a first surface and a second surface opposing the first surface
defining a thickness (t), and a stress profile are disclosed having a thickness (t) of about 3 …

A method of manufacturing a glass substrate to control the fragmentation characteristics by
etching and filling trenches in the glass substrate is disclosed. An etching pattern may be …