Ml-based fast on-chip transient thermal simulation for heterogeneous 2.5 d/3D IC designs
A Kumar, N Chang, D Geb, H He, S Pan… - … Symposium on VLSI …, 2022 - ieeexplore.ieee.org
Large 3DIC designs with multiple chips require several iterations of transient thermal
analysis particularly for fine-grain on-chip dynamic thermal management. This requires a …
analysis particularly for fine-grain on-chip dynamic thermal management. This requires a …
On-Chip Transient Hot Spot Detection with a Multiscale ROM in 3DIC Designs
D Geb, S Asgari, A Kumar, J Wen… - 2022 IEEE 72nd …, 2022 - ieeexplore.ieee.org
Limitations in traditional methods of thermal analysis call for novel methods to meet
emerging needs for chip thermal simulation. The goal in this work is to describe a method to …
emerging needs for chip thermal simulation. The goal in this work is to describe a method to …
Thermal Analysis and Design of Electronics Systems Across Scales Using State-Space Modeling Technique
GV Shankaran, MB Dogruoz… - IEEE Transactions on …, 2021 - ieeexplore.ieee.org
Under a given set of boundary conditions (BCs), the thermal performance of an electronic
system is generally evaluated based on its steady-state response to constant power loads …
system is generally evaluated based on its steady-state response to constant power loads …
Thermal Modeling and Simulation for Advanced 3DIC Systems
N Chang, D Geb, A Kumar, CT Wu… - Direct Copper …, 2024 - taylorfrancis.com
This chapter discusses the challenges and opportunities involved in the thermal modeling
and simulation of advanced three-dimensional integrated circuit (3DIC) systems based on …
and simulation of advanced three-dimensional integrated circuit (3DIC) systems based on …
Electronics system thermal management optimization using finite element and Nelder-Mead method
NK Ab Majid, FS Ismail - … Computing Electronics and Control), 2019 - telkomnika.uad.ac.id
The demand for high-performance, smaller-sized, and multi-functional electronics
component poses a great challenge to the thermal management issues in a printed circuit …
component poses a great challenge to the thermal management issues in a printed circuit …
Modeling and control of thermal processes in semiconductor devices
LA Potapov, AN Shkolin… - … Conference on Industrial …, 2019 - ieeexplore.ieee.org
The study showed the method of determining thermal resistances “junction-case” and “case-
ambient” revealing the possibility of determining these thermal resistances using a transient …
ambient” revealing the possibility of determining these thermal resistances using a transient …